Please keep per attached files confidential, delete it after viewing.
-CounterCheck existing footprints library/Add new (almost not required to) where it is applicable (Datasheets and Library will be provided later)
-Design PCB Outline/Component Placement based on Product Design Files
-Layout (A sample of similar chipset of Vias Under BGA is provided, file name "Eddy Modification"), please perform design rule check before submit to me
Bid only if you are sure can complete the project (Dont give up halfway!). One has been missing and one gave up this project, time and project fee are wasted.
Budget is around USD250
Future Projects are highly possible
Track Width/Spacing 4/4 mil 0.1016/0.1016 mm
Track-Pad 3.937 mil 0.1mm
BGA Pad/Spacing 7.874/7.874 mil 0.2/0.2 mm
Vias under BGA
via hole/annular ring/via width 8/5/18 mil
Electronics Schematics, Product Design (Dimensions), PCB Layout
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12 freelancers estão ofertando em média $3007 para esse trabalho
Hi I have more than 7 years of experience in PCB/Circuit Design I worked many multiple multi disciplinary projects including BGAs and fine pitch ICs. I can do this with considering all EMI /EMC and IPC standards.
I am working as a service engineer for 7years.I have seen nearly 6-7 projects .I am a team leader for 5 [login to view URL] I am good in troubleshooting.