## BIO
**PROFESSIONAL EXPERIENCE:**
*
ELECTRONICS DESIGN ENGINEER*: May 2002 –Aug 2004: Maxima Technologies, Lancaster, PA.
o Designed embedded software and electronic hardware for rugged automotive controls and instrumentation applications
o Utilized software development tools such as simulators, debuggers, and emulators to write and test real-time C / Assembly code for microcontroller targets
o Designed analog and digital circuitry, including schematic capture, software simulation and layout
o Demonstrated technical proficiency and innovation through design of award winning product
o Recognized as co-inventor on two pending patents
o Managed project subsystems from concept to manufacture using critical path method
o Applied engineering principles to meet complex and conflicting design requirements
o Provided supervision to technicians and PCB drafters
*DISTRIBUTION ENGINEER INTERN*: Summers 2000, 2001: First Energy, Reading, PA
o Analyzed power distribution circuits for thermal, voltage and power factor issues
o Recommended changes for improved system efficiency and cost reduction
**ACADEMIC RESEARCH:**
*DIGITAL SIGNAL COMPRESSION:* Oct 2003- Present*,* The Pennsylvania State University
o Designed DSP signal compression algorithm for hi-fidelity audio using wavelet transform
o Implementations both in MATLAB simulation and Texas Instruments TMS320C6000 DSP
**EDUCATION:**
o Master of Engineering in Electrical Engineering, The Pennsylvania State University, Capital College, Middletown, PA. May 2005. Concentration in signal processing
o Bachelor of Science in Electrical Engineering, May, 2002, The Pennsylvania State University, Capital College, Middletown, PA. GPA 3.6/4.0 in major
o Engineer in Training (EIT) license, Pennsylvania, October 2002
**SKILLS:**
* Extensive computer software skills including C/C++, Assembly, VB, Matlab, Orcad, MS Project
* Excellent written and oral communication skills
* Self motivated, independent learner
* Experienced in working in a team environment
**PROFESSIONAL AFFILIATION:**
o IEEE Susquehanna Section, Sept. 2000 – Present
## Area of Expertise
* Embedded Systems
* Microchip PIC, ARM, HC11, Atmel
* Electronics Design
* Automotive and high temp / rugged sensors
* C, C++, Java, VB, Matlab, Labview